The PCB of microcrystalline circuit board laser the microporous drilling: As electronic products towards the development of a portable, miniaturized direction, the increasingly high demand for the miniaturization of the circuit board. For example, circuit boards per square centimeter of the modern mobile phones and digital cameras installed about 1200 interconnects. The key is to raise the level of miniaturization of the circuit board the increasingly narrow linewidth and at different levels between the lines getting smaller and smaller micro vias. For the micro-vias, in order to effectively ensure the electrical connection between layers, and the external device fixed in the design of high-speed, high-density PCB, designers always want vias smaller the better so that the board can not only leaving more space for wiring, and the through-hole is smaller, the more suitable for high-speed circuits; so that through the micro-vias, not only provides the high-speed connection in the surface mounting device with the following signals between the panel, but also effectively reduces the area, printed circuit boards (PCB) is gradually showing the characteristics of the main laminated, multi-functional high-density interconnect technology. The smallest size of the traditional mechanical drilling only 100μm, which obviously does not satisfy the requirements, a new type of laser micro vias processing methods. CO2 laser processing industrially available pore diameter of 30-40μm pores or apertures of about 10μm with a UV laser processing. Enterprise purpose: to research and development of laser application technology as its mission to create the laser industry to attain quality for the mission! Business philosophy: to create a leading, leading the way! The Xinghua laser, welcome friends from all walks of life mustard Pro! 

keywords: Laser microporous, laser drilling machine,